Solders

Solders
Related
Technical Documents
Related
Blog Posts

Indium Corporation offers solders in many different alloys, forms, shapes, and sizes. Solder is used to make electrical, mechanical, and thermal connections in a wide variety of applications. Choosing the best solder for your application will depend on desired melting temperature, form and application.

Below are the various forms of solder that we offer, as well as an alloy selection guide to help you determine the right alloy for your needs. If you have any questions about what solder you need for your application, please feel free to contact us. Our technical support engineers are ready to help you in any way they can.

Related Markets and Applications

Solders Technical Documents

Whitepapers

View All

Application Notes

Procedures for Handling Indalloys (Liquid at Room Temperature) (Letter)

Product Data Sheets

AuSn Preforms for Die-Attach Application (Letter)

Bismuth Solder (Letter)

Bonding Non-Metallic Materials (Letter)

Clad Solder Preforms (Letter) (A4)

Eutectic Gold/Tin Solder (Letter) (A4)

Flux Coatings for Solder Preforms (Letter)

Indalloy^® Alloys Liquid at Room Temperature (Letter) (A4)

InFORMS^® (Letter)

InTEGRATED^® Preforms (Letter)

NC-10HF Flux Coating for Solder Preforms (Letter)

Nitinol Soldering Kit (Letter) (A4)

No-Clean Flux Coatings for Solder Preforms (Letter)

Pb-Free Solder Fabrications (Letter)

PoP Interconnect Spacers (Letter) (A4)

Precision Solder Spheres (Letter) (A4)

Shot (Letter) (A4)

Solder Fortification^® Preforms (Letter) (A4)

Solder Kits (Letter)

Solder Preforms (Letter) (A4)

Solder Ribbon and Foil (Letter) (A4)

Solder Tubes (Letter) (A4)

Solder Wire (Letter) (A4)

Tape and Reel Preforms (Letter) (A4)

View All

Material Safety Data Sheets

Indalloy^® 128 (Tin)

Indalloy^® 176 (Zinc Metal Mix)

Indalloy^® 207

Indalloy^® Containing Indium with Tin, Lead, Silver, Copper

Indalloy^® Tin and Lead Only

Indalloy^® with Lead, Zinc and Antimony

Indalloy^® 170 (Lead)

Indalloy^® 193

Indalloy^® 4 (Indium)

Indalloy^® Indium with Tin, Lead or Silver

Indalloy^® with Lead and/or Tin and/or Silver and Antimony

Indalloy^® with Tin, Lead and/or Silver and/or Copper

View All

Solder Blog Posts

NanoBond® is a Fluxless Process

Thursday, May 16, 2013 by Jim Hisert [view bio]

Fluxes are an interesting element of working with many solder applications. With so many specialized fluxes there is usually a perfectly-tailored flux for removing oxides from any solderable surface. Even though we love fluxes at Indium Corporation – not all of our customers share that same affection. It…

High Temperature (Braze Alloy) Sputtering Target Bonding, with NanoFoil®

Tuesday, May 14, 2013 by Jim Hisert [view bio]

In an earlier post I mentioned one of the presentations we gave at the 2013 SVC TechCon. The other presentation that our team delivered at the show (presented by Jacques Mateau) regarded another very interesting topic. The paper, High Temperature, Pb-Free, Metallic Sputtering Target Bonding…

NanoFoil® for CPV Attachment

Thursday, April 18, 2013 by Jim Hisert [view bio]

The attachment of concentrated photovoltaic (CPV) cells is the perfect application for NanoFoil®. Due to the isolated heating during bonding, less stresses are imparted due to coefficient of thermal expansion. Unlike conductive adhesives or epoxies, NanoBonds® are full metal interfaces which…

View All Blog Posts