Solder TIM (sTIM)
Introduction
Indium Corporation’s Solder Thermal Interface Materials Radically Improve:
- Heat dissipation efficiency in electronic devices
- Thermal conductance for high power devices – with densities in excess of 1000 watts
- End-of-life performance at the thermal interface – to avoid failures common with fluidic solutions such as greases
- Portable device battery performance – by reducing thermal resistance and cooling fan size
- Portable device use profile – by reducing heatsink size and mass
- Compliance with RoHS while accommodating step soldering requirements
Indium Corporation has solutions for:
- Telecom
- Medical
- Computing
- Cryogenics
- Semiconductors
- Automotives
- LEDs
- Power Devices
- Photonics
Confidentiality
Indium Corporation recognizes the Importance of confidentiality in the design of thermal interface solutions. As a trusted partner, our engineers will work with you to help you find the right solution for your thermal interface problems. We can help you find the right alloy for performance and the best solder form for ease of assembly.
Applications
Some non-confidential applications include:
- Semiconductor Integrated Circuits
- Power QFNs
- Power device to PCB attach (TO220, etc.)
- Telecom
- Die Attach (Photonics, MOSFETS, etc.)
- LED attach
Products
- AuSn solder
- InPb solders
- Pure Indium
- Informs®
- SnPb solders
- SAC Pb-Free solders
The Indium Advantage
We are committed to understand your unique needs for materials in your product and for your process. No company offers a wider selection of alloys and solder forms to meet your needs. Our variety of alloys, ability to fabricate and package these alloys into easy-to-use forms, and our decades of application knowledge are the core values we bring to your company. Tap into this knowledge-base by calling one of our certified engineers at 1-800-4-INDIUM or email us.
Solder TIM Technical Documents
Application Notes
No application notes to display
Product Data Sheets
Material Safety Data Sheets
Thermal Interface Materials Blog Posts
NanoFoil® for CPV Attachment
The attachment of concentrated photovoltaic (CPV) cells is the perfect application for NanoFoil®. Due to the isolated heating during bonding, less stresses are imparted due to coefficient of thermal expansion. Unlike conductive adhesives or epoxies, NanoBonds® are full metal interfaces which…
Coefficient of Thermal Expansion
When dealing with bonding, we often mention CTE (Coefficient of Thermal Expansion). This is a very important topic when designing a soldered interface, whether you are choosing materials that will expand and contract at the same rate or bonding alloys or processes that will handle the stress of…
Thermal conductivity of NanoFoil®
A NanoBond® acts like a traditional solder bond in many ways. After reaction, the bulk properties of NanoFoil® are similar to that of many solders. To me, the property that is most attractive (since it is similar to that of a solder) is the thermal conductivity of reacted NanoFoil®. Just…
This page is owned by:
Jordan Ross
Senior Product Manager, Engineered Solders and Thermal Materials
jross@indium.com
From One Engineer to Another®
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