Solder Redefined Part 4 – Baseplate to Heat-Sink
At Indium Corporation, we're redefining how we use solder at the die-attach, DBC to baseplate, and baseplate to heat-sink levels so we can achieve...
Baseplate
Solder Redefined Part 3 – DBC Substrate to Baseplate
As we've discussed, there are three attach levels of peak concern in the IGBT stack up. At Indium Corporation, we're redefining how we use sol...
Achieving Uniform Solder Bondline Control Between Substrate and Baseplate in IGBTs: Part I
The next few posts come to us from my colleagues Karthik Vijay, Indium Corporation’s Technical Manager for Europe and Liam Mills of TT Electroni...