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Day 2 of the Device Packaging Conference

  • Flux
  • Indium Corporation
  • Today I had a chance to catch up with the guys from Sikama at their booth. Pictured here from left to right are: Sigurd Wathne (President and Founder), myself, and Phillip Skeen.

    The conduction reflow equipment in the foreground of the picture is what I use to evaluate different flux/alloy/surface finish combinations. Sure it’s not the intended use, but I’ve been using the tabletop unit instead of an old fashioned hotplate because I like the temperature control accuracy. Look forward to the full article on simple test methods in Advanced Packaging this fall.