Indium Corporation Technical Papers at SMTAI
This video highlights some must-see activities at SMTAi 2018 in Rosemont, Illinois on October 14-18. LIVE@SMTAi allows you to see Indium Cor...
An Overview of Vacuum Reflow Soldering
Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, and Phil Zarrow, discuss approaches for reaching near zero voiding and how v...
Wave Flux and Reliability
Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, and Phil Zarrow discuss the use of pallets when wave soldering and its impac...
Wave Flux Applications & Pre-Heat Considerations
Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, and Phil Zarrow discuss the pre-requisites of wave flux application, such as...
History & Future of Resistivity Of Solvent Extract (ROSE) Testing
Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, and Phil Zarrow discuss the history of the ROSE test method, its gradual des...
Process & Materials Interaction Investigation
Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, and Phil Zarrow discuss the replacement of the ROSE (Resistivity of Solvents...
How to Manage Worst-Case Shipping Scenarios
Indium Corporation’s Brook Sandy-Smith and Phil Zarrow outline good shipping practices. ...
Avoid the Void®: An Introduction to Indium10.1HF Solder Paste
Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, and Phil Zarrow introduce Indium Corporation’s new halogen-free, no-cl...
SMTA International 2017: Warpage-Induced Defects & Component Warpage Limits Panel Discussion
Brook Sandy-Smith will chair a panel on Warpage-Induced Defects & Component Warpage Limits at SMTAI 2017 ...
SMTAI 2017: Warpage-Induced Defects Panel & Show Overview
Brook Sandy-Smith and Phil Zarrow preview some of the events they are looking forward to at SMTAI 2017 ...
Avoid The Void®: Indium8.9HF Halogen-free, Pb-free Solder Paste with Andreas Karch
Andreas Karch reviews how you can Avoid The Void® with Indium8.9HF Solder Paste ...
Test Methods for ECM Assessment & Process Control: Basics of ECM
Brook Sandy-Smith and Phil Zarrow introduce a four-part series on electrochemical migration (ECM) assessment and process control...