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Join Me at SMTA Pan Pacific February 5-8

Category:
  • Solder

  • Folks,

    I am presenting a paper, chairing a technical session, and hosting a technical panel at SMTA Pan Pacific on February 6, 2018 at the Hapuna Beach Prince Resort in Hawaii.

    The paper is “Using Cpk and Cpk Confidence Intervals to Evaluate Stencil Printing,” with my co-author Chris Nash of Indium Corporation. In this paper I will discuss how to calculate confidence intervals when using Cpk to evaluate the quality of stencil printing. By comparing the confidence intervals of Cpks one can determine whether or not there is a statistically significant difference between different samples of stencil printing data.

    The session I am chairing is on “Advanced Materials.” The papers in the session are:

    • “Oxygen Vacancy Migration in MLCCs” by Dock Brown, CRE, DfR Solutions
    • “Update on Cu-Ni/Sn Alloy Composite Solder Paste for Harsh Environments” by Stephanie Choquette, Ph.D., Iowa State University and Iver Anderson, Ames Laboratory (USDOE)
    • “Resistivity Stain Analysis of Graphene Coated Fabric for Wearable Electronics” by Martine Simard-Normandine, Ph.D., S. Ferguson, MuAnalysis Inc. and K. Manga, Q.-B. Ho Grafoid

    The panel topic is “Solders for Harsh Environments.” Brief presentations will be given by some of the panelists with a question and answer period to follow. The panelists are Dwight Howard of Delphi Automotive, Iver Anderson of Ames Lab, John Evans of Auburn University, and Prabjit Singh of IBM.

    We will learn a lot. I hope to see you there!

    Cheers,

    Dr. Ron