On Monday, March 24, I will be giving a professional development course at the IPC APEX Expo in Las Vegas, Nevada.
The course, Understanding and Solving Head-In-Pillow, Non-Wet Open, and QFN/CSP Voiding Challenges, will cover many of the factors that contribute to the three most challenging lead-free assembly defects. It will also cover how to optimize processes and material to reduce the potential for these issues. Finally, it will include a thorough discussion of the mechanisms leading to these defects and why they are more prevalent today than in the past.
For more information, or to register, click here. Register before February 28 and receive 20% off your registration fee.