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Flux-Cored Wire

Home » Products » Flux and Epoxy » Flux-Cored Wire

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Gallium

Indium Corporation is quickly becoming known as one of the highest quality, full line suppliers of flux-cored wire solder. Indium Corporation uses only “conflict-free” and grade A (per ASTM B32) metals, as well as other high purity metals for its flux-cored wire. Our materials have been tested and certified to meet IPC J-STD-004B and other relevant industry specifications, including the legacy military specification QQ-S-571f. Indium Corporation’s flux-cored wire is well known for its:

  • evenly layer winding
  • low oxide shiny appearance over time
  • non-offensive odor for the 800 series and 200 series fluxes

Core Flux Formulas

Flux
Number
J-STD-
004
J-STD-
004B
QQ-S-
571f
Halogen
Content
JIETA
ET-7304
Halogen
Free
Residue Residue
Removal
Preferred
Alloys
Application/
Comments
CW-102 ROL0 ROL0 "R" < 50 ppm Yes light amber NC,
So,
Sa*
SnPb, Pb-Free Military type "R" for legacy applications, very low activity
Core 92 ROL0 ROL0 "RMA" < 50 ppm Yes light amber NC,
So,
Sa*
SnPb Low activity, RMA based on SMQ92J paste technology
CW-802 ROL0 ROL0 "RMA" < 50 ppm Yes colorless NC,
So,
Sa*
SnPb, Pb-Free No halogen added, low activity, no-clean
CW-807 ROL0 ROL0 "RMA" < 500 ppm Yes colorless NC,
So,
Sa*
SnPb, Pb-Free General purpose electronics soldering
CW-807M ROL0 ROL1 "RMA" < 1500 ppm Yes colorless NC,
So,
Sa*
SnPb, Pb-Free Hard-to-solder, general purpose electronics applications
CW-807 HMP ROL0 ROL0 "RMA" < 500 ppm Yes light amber NC,
So,
Sa*
High Pb containing High temperature, mildly active, modified rosin for high-lead containing alloys
CW-501 REL0 REL1 N/A > 1500 ppm as Br No colorless NC,
So,
Sa*
Pb-Free Higher activity, modified rosin core for electronics
Core 230 ROL1 ROL1 N/A > 1500 ppm as Br No dark amber NC,
So,
Sa*
Pb-Free Higher activity, rosin core for electronics
CW-201 ROM1 ROM1 "RA" < 0.5% No light amber So,
SA,
NCH
SnPb Electrical application, will solder copper, brass, nickel, etc.
CW-207 ROM1 ROM1 "RA" < 0.5% No colorless So,
SA,
NCH
Pb-Free Electrical application, will solder oxidized copper, brass, nickel ,etc.
CW-209 ROM1 ROM1 "RA" < 1.0% No colorless So,
SA,
NCH
SnPb, Pb-Free Electrical application, will solder oxidized copper, oxidized brass, nickel, etc.
CW-301 ORH1 ORH1 "OR" ~3.0% No amber water SnPb,
Pb-Free
Water washed electronics applications
CW-901 N/A N/A "IA" > 3.0% No white water/
neutralizer
SnPb,
Pb-Free
Inorganic acid, water wash flux for stainless steel and aluminum

NC=No-clean
So= Solvent
Sa= Saponification
NCH= No-clean for non-sensitive non-electronic applications

Diameter 0.120" 0.062" 0.040" 0.032" 0.025" 0.020" 0.015" 0.010"
cross-
section
(sq in)
      0.0008041984 0.00049084375 0.00031414 0.00017670375 0.000078535
in/lb
63/37
      4152 6802 10629 18895 42514
ft/lb
63/37
      346 567 886 1575 3543
ft/lb
SAC 305
        643 1005 1787 4021

Standard Diameters and Packaging

Inches mm equiv. Tolerance Packaging Cartons
0.010" 0.25 ± 0.002" 1/4 lb. 10 - 1/4 lb. spools
0.015" 0.38 ± 0.002" 1/4 lb., 1 lb. 10 - 1 lb. spools
0.020" 0.50 ± 0.002" 1 lb. 10 - 5 lb. spools
0.025" 0.63 ± 0.002" 1 lb. per box
0.032" ~ 0.75 ± 0.002" 1 lb.  
0.040" 1.0 ± 0.002" 1 lb., 5 lb.  
0.062" ~ 1.5 ± 0.002" 1 lb., 5 lb., 20 lb. 2 - 20 lb spools
0.120" 3.0 ± 0.002" 1 lb., 5 lb., 20 lb. per box

Alloys, Flux Percent by Weight, and Shelf Life

Alloys High Flux % Medium Flux % Low Flux % Very Low Flux % Shelf Life
(< 26°C & < 60%RH)
SnPb < 80% Pb 2.7 - 3.2% 1.7 - 2.2% 0.8 - 1.2%   3 years
Pb-Free Alloys 3.3 - 3.7% 2.7 - 3.2% 1.7 - 2.2% 0.8 - 1.2% 3 years
High Lead > 80% 1.7 - 2.2% 1.3 - 1.7% 0.8 - 1.2%   1 year

Flux percent is measured by weight. The volume of flux compared to the weight percent varies with the density of the alloy.

*Indium Corporation can produce many of the alloys on its alloys list as cored wire. Alloys containing greater than 20% bismuth, greater that 8% antimony, or greater than 5% silver cannot be produced as flux-cored wire at this time.

Related Markets and Applications

  • PCB Assembly
  • Rework and Touch-Up

Flux-Cored Wire Technical Documents

Whitepapers

Request This Document

Compatibility of Polymers and Fluxes: Getting to the Heart of the Matter

Authors: Andy C. Mackie PhD, Chris Nash

Posted on 4 Mar 2010

Request This Document

The Evolution Revolution in Flux

Authors: Andy C. Mackie PhD, Jim Hisert

Posted on 10 Mar 2010

Application Notes

Storage and Handling of Specialty Fluxes (Letter)

Product Data Sheets

Activated Flux-Cored Wire (Letter) (A4)
Core 230 Cored Wire Solder (Letter) (A4)
CORE 92 No-Clean Cored Wire Solder (Letter) (A4)
CW-102 Non-Activated Rosin Flux-Cored Wire (Letter) (A4)
CW-301 Water-Soluble Cored Wire Solder (Letter) (A4)
CW-807-HMP Flux Cored Wire (Letter) (A4)
CW-901 Acid Cored Wire (Letter)
No-Clean Flux-Cored Wire (Letter) (A4)

View All

Material Safety Data Sheets

Core 230 Flux Cake
Fluxcake-201
Fluxcake-301
Fluxcake-801
Core 92 Flux Cake
Fluxcake-207
Fluxcake-501

View All

Cored Solder Wire Blog Posts

How to Solder a Wire to a Pad

Friday, November 02, 2012 by Paul Socha [view bio]

It seems like a fairly simple thing to do.  What could be difficult about soldering a wire to a pad?  Well, I hear three common complaints and expressions of frustration: POSITIONING: Typically, in this process, a soldering iron is used. The first problem arises from trying to hold onto…

High Melting Point Flux Core Wire Solder

Tuesday, July 17, 2012 by Carol Gowans [view bio]

It won't be long until we in the northern hemisphere are complaining about the snow and the cold, but right now, it is all about the heat!  In particular about the heat that is needed to reflow high melting point (HMP) alloys.  These are generally high-Pb alloys that see very high operational…

Is Lowest "Cost of Ownership" the Best Electronics Assembly Manufacturing Metric?

Tuesday, February 14, 2012 by Dr. Ron Lasky [view bio]

Folks,Let's look in on Patty and her colleagues......Sam Watkins, ACME New Hampshire site GM, had just finished meeting with his boss, ACME CEO Mike Madigan. He was embarrassed that these meetings always stressed him; Mike was an intimidating character. Still, why should he be nervous? Things were…

View All Blog Posts

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Eric Slezak

This page is owned by:

Eric Slezak
Director of Business Development and Printed Circuit Board Assembly
eslezak@indium.com

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