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Indium Corporation Earns CIRCUITS ASSEMBLY New Product Introduction Award at IPC APEX 2018

February 28, 2018

Indium Corporation has earned the CIRCUITS ASSEMBLY New Product Introduction (NPI) Award for its Core 230-RC flux-cored wire at the IPC APEX Expo technical conference on February 27 in San Diego, Calif.

The NPI Awards recognize the leading new products for electronics assembly during the past 12 months. Honorees are selected by an independent panel of practicing engineers. 

"Developing Core 230-RC and having the electronics assembly industry recognize it as a leading new product, is truly a great honor," said Tim Twining, Vice President, Marketing. "I am very proud of our team and the work they have done to develop and deliver this high-performance product to our customers."

Indium Corporation's Core 230-RC is a new REACH- and RoHS-compliant, J-STD-004B tested and compliant "no-spatter" formula cored wire.

"In 2017, Indium Corporation sold more than 932 miles (1,500 kilometers) of 0.2 mm diameter flux-cored wire on 114-gram level wound spools," said Eric Slezak, Director of Business Development and Printed Circuit Board Assembly. "Indium Corporation is the only company that can put ¼ lb. of 0.2 mm cored wire on a level wound spool in volume and ensure no tangling or feeding issues. This enables a more efficient and lengthy robotic soldering process."

Core 230-RC delivers an exceptionally impressive 0.09% total flux spatter, as tested per IPC TM-650 2.4.48. "No-spatter" is important so that flux does not contaminate gold fingers or other contacts where it can interfere with circuit board electrical properties, or spatter hot flux on operators' hands. It is available in lead-free, tin-lead, and high-lead cored wires. In lead-free cored wire the available diameters are from 0.008" (0.2mm) up to 0.125" and flux weight content from 1.0% to 4.5%.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

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