The assembly of medical devices uses a wide variety of alternative soldering processes, of which the most frequently used solder products include paste, preforms, wire, spheres, and flux. Precision solder is required for these wearable, implantable, and industrial devices as they must be of high-quality and high-reliability, and be long-lasting.
Read MoreSoldering iron tip temperatures are increasing under the thought that hotter settings perform faster to reduce cycle times. However, that is not always the case. In fact, according to this wire supplier and other soldering iron tip manufacturers, it's better to start as low as possible and work your way up to find the perfect temperature for your application.
Read MoreCharring is a common defect in hand and robotic soldering using flux-cored wire. Robert McKerrow explains what causes this and how to avoid it.
Read MoreIndium Corporation uses only “conflict-free” and grade A (per ASTM B32) metals, as well as other high purity metals for its flux-cored wire. Our materials have been tested and certified to meet IPC J-STD-004B and other relevant industry specifications, including the legacy military specification QQ-S-571f. Indium Corporation’s flux-cored wire is well known for its:
| Flux Number |
J-STD- 004 |
J-STD- 004B |
QQ-S- 571f |
Halogen Content |
JIETA ET-7304 Halogen Free |
Residue | Residue Removal |
Preferred Alloys |
Application/ Comments |
|---|---|---|---|---|---|---|---|---|---|
| Core 230-RC | REL0 | REL1 | N/A | > 1500 ppm as Br | No | light amber | NC So Sa* |
SnPb, Pb-Free |
Extremely low spatter, excellent for robotic soldering, general purpose electronics soldering |
| CW-807 | ROL0 | ROL0 | "RMA" | < 500 ppm | Yes | colorless | NC So Sa* |
SnPb, Pb-Free |
General purpose electronics soldering |
| CW-807-M | ROL0 | ROM1 | "RMA" | < 1500 ppm | Yes | colorless | NC So Sa* |
SnPb, Pb-Free |
Hard-to-solder, general purpose electronics applications |
| CW-807-H | ROL0 | ROL0 | "RMA" | < 500 ppm | Yes | light amber | NC So Sa* |
High Pb containing | High temperature, mildly active, modified rosin for high-lead containing alloys |
| CW-501 | REL0 | REL1 | N/A | > 1500 ppm as Br | No | colorless | NC So Sa* |
Pb-Free | Higher activity, modified rosin core for electronics |
| CW-802 | ROL0 | ROL0 | "RMA" | < 50 ppm | Yes | colorless | NC So Sa* |
SnPb, Pb-Free |
No halogen added, low activity, no-clean |
| CW-102 | ROL0 | ROL0 | "R" | < 50 ppm | Yes | light amber | NC So Sa* |
SnPb, Pb-Free |
Military type "R" for legacy applications, very low activity |
| Core 92 | ROL0 | ROL0 | "RMA" | < 50 ppm | Yes | light amber | NC So Sa* |
SnPb | Low activity, RMA based on SMQ92J paste technology |
| Core 230 | ROL1 | ROL1 | N/A | > 1500 ppm as Br | No | dark amber | NC So Sa* |
Pb-Free | Higher activity, rosin core for electronics |
Key: NC=No-clean | So= Solvent | Sa= Saponification | NCH= No-clean for non-sensitive non-electronic applications
| Flux Number |
J-STD- 004 |
J-STD- 004B |
QQ-S- 571f |
Halogen Content |
JIETA ET-7304 Halogen Free |
Residue | Residue Removal |
Preferred Alloys |
Application/ Comments |
|---|---|---|---|---|---|---|---|---|---|
| CW-232 | N/A | ROM1 | N/A | < 1.0% | No | Light amber | So Sa NCH |
SnPb, Pb-Free |
Extremely low spatter, excellent for robotic soldering where more activity is desired and cleanliness is important. |
| CW-219 | ROM1 | ROM1 | "RA" | < 1.0% | No | colorless | So Sa NCH |
SnPb, Pb-Free |
Extremely fast-wetting. Electrical application, will solder oxidized copper, oxidized brass, nickel, etc. |
| CW-209 | ROM1 | ROM1 | "RA" | < 1.0% | No | colorless | So Sa NCH |
SnPb, Pb-Free |
Electrical application, will solder oxidized copper, oxidized brass, nickel, etc. |
| CW-207 | ROM1 | ROM1 | "RA" | < 0.5% | No | colorless | So Sa NCH |
Pb-Free | Electrical application, will solder oxidized copper, brass, nickel, etc. |
| CW-201 | ROM1 | ROM1 | "RA" | < 0.5% | No | light amber | So Sa NCH |
SnPb | Electrical application, will solder copper, brass, nickel, etc. |
Key: NC=No-clean | So= Solvent | Sa= Saponification | NCH= No-clean for non-sensitive non-electronic applications
| Flux Number |
J-STD- 004 |
J-STD- 004B |
QQ-S- 571f |
Halogen Content |
JIETA ET-7304 Halogen Free |
Residue | Residue Removal |
Preferred Alloys |
Application/ Comments |
|---|---|---|---|---|---|---|---|---|---|
| CW-301 | ORH1 | ORH1 | "OR" | ~3.0% | No | amber | water | SnPb, Pb-Free |
Water washed electronics applications |
| CW-305 | ORM0 | ORH0 | "OR" | <500ppm | Yes | amber | water | SnPb, Pb-Free |
Next generation halogen-free water-wash, exhibits almost no corrosivity |
| CW-901 | N/A | N/A | "IA" | > 3.0% | No | white | water/ neutralizer |
SnPb, Pb-Free |
Inorganic acid, water wash flux for stainless steel |
| Diameter | 0.032" | 0.025" | 0.020" | 0.015" | 0.010" |
|---|---|---|---|---|---|
| cross- section (sq in) |
0.000804198 | 0.00049084375 | 0.00031414 | 0.00017670375 | 0.000078535 |
| ft/lb 63/37 |
346 | 567 | 886 | 1575 | 3543 |
| ft/lb SAC 305 |
309 | 643 | 1005 | 1787 | 4021 |
| Inches | mm equiv. | Tolerance | Packaging |
|---|---|---|---|
| 0.008" | 0.20 | ± 0.001" | 1/4 lb. |
| 0.010" | 0.25 | ± 0.001" | 1/4 lb. |
| 0.015" | 0.38 | ± 0.002" | 1/4 lb. |
| 0.020" | 0.50 | ± 0.002" | 1 lb. |
| 0.025" | 0.63 | ± 0.002" | 1 lb. |
| 0.032" | ~ 0.75 | ± 0.002" | 1 lb. |
| 0.040" | 1.0 | ± 0.002" | 1 lb., 5 lb. |
| 0.062" | ~ 1.5 | ± 0.002" | 1 lb., 5 lb., 20 lb. |
| 0.120" | 3.0 | ± 0.002" | 1 lb., 5 lb., 20 lb. |
| Alloys | High Flux % |
Medium Flux % |
Low Flux % |
Very Low Flux % |
Shelf Life (< 26°C & < 60%RH) Warranted from DOM |
Practical** |
|---|---|---|---|---|---|---|
| SnPb < 80% Pb | 2.7 - 3.2% | 1.7 - 2.2% | 0.8 - 1.2% | 3 years | Indefinite | |
| Pb-Free Alloys | 3.3 - 3.7% | 2.7 - 3.2% | 1.7 - 2.2% | 0.8 - 1.2% | 3 years | Indefinite |
| High Lead > 90% | 1.7 - 2.2% | 1.3 - 1.7% | 0.8 - 1.2% | 1 year | Indefinite |
Flux percent is measured by weight. The volume of flux compared to the weight percent varies with the density of the alloy.
*Indium Corporation can produce many of the alloys on its alloys list as cored wire. Alloys containing greater than 20% bismuth, greater that 8% antimony, or greater than 5% silver cannot be produced as flux-cored wire at this time.
**When stored at less than 40°C and less than 80% RH
