Flux-Cored Wire

Flux-Cored Wire

Features & Benefits

Indium Corporation is quickly becoming known as one of the highest quality, full line suppliers of flux-cored wire solder.

Indium Corporation uses only “conflict-free” and grade A (per ASTM B32) metals, as well as other high purity metals for its flux-cored wire. Our materials have been tested and certified to meet IPC J-STD-004B and other relevant industry specifications, including the legacy military specification QQ-S-571f. Indium Corporation’s flux-cored wire is well known for its:

  • void-free
  • evenly layer winding
  • low oxide shiny appearance over time
  • non-offensive odor for the 800 series and 200 series fluxes

Featured Flux-Cored Wire

Core 230-RC

  • Fast wetting
  • Low-spatter formulation
  • Light-colored residue
  • Compatible with Pb-free and SnPb alloys
  • Physical Properties
    • IPC J-STD-004 Classification: REL0
    • IPC J-STD-004B Classification: REL1
    • Spatter: 0.09%
    • Acid Value (mgKOH/gram of flux): 165

CW-807

  • Halogen-free
  • Clear residue
  • Compatible with Pb-free and SnPb alloys
  • Physical Properties
    • IPC J-STD-004 Classification: ROL0
    • IPC J-STD-004B Classification: ROL0

CW-301

  • Excellent cleanability with cold water
  • Minimal spattering & low odor
  • Resistant to charring
  • Physical Properties
    • IPC J-STD-004 Classification: ORH1
    • IPC J-STD-004B Classification: ORH1

CW-219

  • Highly-active rosin flux for higher throughput
  • Clear residue
  • Compatible with Pb-free and SnPb alloys
  • Physical Properties
    • IPC J-STD-004 Classification: ROM1
    • IPC J-STD-004B Classification: ROM1

CW-232

  • Highly-active and very fast wetting
  • Ultra-low spattering: 0.26%
  • Light colored residue
  • Compatible with Pb-free and SnPb alloys
  • Physical Properties
    • IPC J-STD-004B Classification: ROM1

Core Flux Formulas

No Clean

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Flux
Number		 J-STD-
004 		J-STD-
004B		 QQ-S-
571f		 Halogen
Content		 JIETA
ET-7304
Halogen
Free		 Residue Residue
Removal		 Preferred
Alloys		 Application/
Comments
Core 230-RC REL0 REL1 N/A > 1500 ppm as Br No light amber NC
So
Sa*		 SnPb,
Pb-Free		 Extremely low spatter, excellent for robotic soldering, general purpose electronics soldering
CW-807 ROL0 ROL0 "RMA" < 500 ppm Yes colorless NC
So
Sa*		 SnPb,
Pb-Free		 General purpose electronics soldering
CW-807-M ROL0 ROM1 "RMA" < 1500 ppm Yes colorless NC
So
Sa*		 SnPb,
Pb-Free		 Hard-to-solder, general purpose electronics applications
CW-807-H ROL0 ROL0 "RMA" < 500 ppm Yes light amber NC
So
Sa*		 High Pb containing High temperature, mildly active, modified rosin for high-lead containing alloys
CW-501 REL0 REL1 N/A > 1500 ppm as Br No colorless NC
So
Sa*		 Pb-Free Higher activity, modified rosin core for electronics
CW-802 ROL0 ROL0 "RMA" < 50 ppm Yes colorless NC
So
Sa*		 SnPb,
Pb-Free		 No halogen added, low activity, no-clean
CW-102 ROL0 ROL0 "R" < 50 ppm Yes light amber NC
So
Sa*		 SnPb,
Pb-Free		 Military type "R" for legacy applications, very low activity
Core 92 ROL0 ROL0 "RMA" < 50 ppm Yes light amber NC
So
Sa*		 SnPb Low activity, RMA based on SMQ92J paste technology
Core 230 ROL1 ROL1 N/A > 1500 ppm as Br No dark amber NC
So
Sa*		 Pb-Free Higher activity, rosin core for electronics

Key: NC=No-clean | So= Solvent | Sa= Saponification | NCH= No-clean for non-sensitive non-electronic applications

Activated Flux-Cored Wire

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Flux
Number		 J-STD-
004 		J-STD-
004B		 QQ-S-
571f		 Halogen
Content		 JIETA
ET-7304
Halogen
Free		 Residue Residue
Removal		 Preferred
Alloys		 Application/
Comments
CW-232 N/A ROM1 N/A < 1.0% No Light amber So
Sa
NCH		 SnPb,
Pb-Free		 Extremely low spatter, excellent for robotic soldering where more activity is desired and cleanliness is important.
CW-219 ROM1 ROM1 "RA" < 1.0% No colorless So
Sa
NCH		 SnPb,
Pb-Free		 Extremely fast-wetting. Electrical application, will solder oxidized copper, oxidized brass, nickel, etc.
CW-209 ROM1 ROM1 "RA" < 1.0% No colorless So
Sa
NCH		 SnPb,
Pb-Free		 Electrical application, will solder oxidized copper, oxidized brass, nickel, etc.
CW-207 ROM1 ROM1 "RA" < 0.5% No colorless So
Sa
NCH		 Pb-Free Electrical application, will solder oxidized copper, brass, nickel, etc.
CW-201 ROM1 ROM1 "RA" < 0.5% No light amber So
Sa
NCH		 SnPb Electrical application, will solder copper, brass, nickel, etc.

Key: NC=No-clean | So= Solvent | Sa= Saponification | NCH= No-clean for non-sensitive non-electronic applications

Water Soluble

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Flux
Number		 J-STD-
004 		J-STD-
004B		 QQ-S-
571f		 Halogen
Content		 JIETA
ET-7304
Halogen
Free		 Residue Residue
Removal		 Preferred
Alloys		 Application/
Comments
CW-301 ORH1 ORH1 "OR" ~3.0% No amber water SnPb,
Pb-Free		 Water washed electronics applications
CW-305 ORM0 ORH0 "OR" <500ppm Yes amber water SnPb,
Pb-Free		 Next generation halogen-free water-wash, exhibits almost no corrosivity
CW-901 N/A N/A "IA" > 3.0% No white water/
neutralizer		 SnPb,
Pb-Free		 Inorganic acid, water wash flux for stainless steel
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Diameter 0.032" 0.025" 0.020" 0.015" 0.010"
cross-
section
(sq in)		 0.000804198 0.00049084375 0.00031414 0.00017670375 0.000078535
ft/lb
63/37		 346 567 886 1575 3543
ft/lb
SAC 305		 309 643 1005 1787 4021

Standard Diameters and Packaging

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Inches mm equiv. Tolerance Packaging
0.008" 0.20 ± 0.001" 1/4 lb.
0.010" 0.25 ± 0.001" 1/4 lb.
0.015" 0.38 ± 0.002" 1/4 lb.
0.020" 0.50 ± 0.002" 1 lb.
0.025" 0.63 ± 0.002" 1 lb.
0.032" ~ 0.75 ± 0.002" 1 lb.
0.040" 1.0 ± 0.002" 1 lb., 5 lb.
0.062" ~ 1.5 ± 0.002" 1 lb., 5 lb., 20 lb.
0.120" 3.0 ± 0.002" 1 lb., 5 lb., 20 lb.

Alloys, Flux Percent by Weight, and Shelf Life

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Alloys High
Flux %		 Medium
Flux %		 Low
Flux %		 Very
Low
Flux %		 Shelf Life
(< 26°C & < 60%RH)
Warranted from DOM		 Practical**
SnPb < 80% Pb 2.7 - 3.2% 1.7 - 2.2% 0.8 - 1.2%   3 years Indefinite
Pb-Free Alloys 3.3 - 3.7% 2.7 - 3.2% 1.7 - 2.2% 0.8 - 1.2% 3 years Indefinite
High Lead > 85% 1.7 - 2.2% 1.3 - 1.7% 0.8 - 1.2%   2 years Indefinite

Flux percent is measured by weight. The volume of flux compared to the weight percent varies with the density of the alloy.

*Indium Corporation can produce many of the alloys on its alloys list as cored wire. Alloys containing greater than 20% bismuth, greater that 8% antimony, or greater than 5% silver cannot be produced as flux-cored wire at this time.

**When stored at less than 40°C and less than 80% RH

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