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Improve SMT Stencil Printing using StencilCoach®

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  • This video is for electronics assembly engineers, technicians, and managers that are seeking to improve SMT stencil printing. It includes details about how stencil printing and pin-in-paste with preforms can reduce costs.

    Keywords: indium, Indium Corporation, pin and paste preforms, Dr. Ron Lasky,, Phil Zarrow,,  stencilCoach, ball grid array,plastic quad flat pack, package aperture, passives, bottom terminated, solder balling, home plate design,
    intrusive soldering, pin and paste, solder preforms