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Improve SMT Stencil Printing using StencilCoach®

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  • Solder
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  • This video is for electronics assembly engineers, technicians, and managers that are seeking to improve SMT stencil printing. It includes details about how stencil printing and pin-in-paste with preforms can reduce costs.

    Keywords: indium, Indium Corporation, pin and paste preforms, Dr. Ron Lasky, ronlasky@aol.com, Phil Zarrow, itm@itmconsulting.org,  stencilCoach, ball grid array,plastic quad flat pack, package aperture, passives, bottom terminated, solder balling, home plate design,
    intrusive soldering, pin and paste, solder preforms