How to Release The Liner from HSMF Thermal Interface Materials (TIMs)
In this video, Indium Corporation’s Kay Parker, Technical Support Engineer, demonstrates how to remove the release liners from HSMF thermal inte...
Videos
Indium Corporation Technical Papers at SMTAI
This video highlights some must-see activities at SMTAi 2018 in Rosemont, Illinois on October 14-18. LIVE@SMTAi allows you to see Indium Cor...
Tech Seconds: What is a Shoulder Reflow Profile?
In this installment of Tech Seconds, Phil describes when to use a shoulder profile. ...
Tech Seconds: How to Troubleshoot Head-in-Pillow (HIP) Defects
In this installment of Tech Seconds, Phil examines the best methods used to troubleshoot head-in-pillow (HIP) defects ...
Tech Seconds: X-ray Analysis Electronics Assembly
In this installment of Tech Seconds, Phil discusses the basics of X-ray analysis for electronics assembly and how to identify soldering voids....
Tech Seconds: How to Eliminate Head-in-Pillow (HIP) Defects
In this installment of Tech Seconds, Phil describes how to diagnose defects caused by head-in-pillow (HIP). ...
Tech Seconds: Troubleshooting Voiding
In this installment of Tech Seconds, Phil outlines how to effectively troubleshoot voiding issues when a customer notices an increase in the amount of...
Tech Seconds: Voiding - Symptom or Defect?
How do you determine whether your voids are a symptom or a defect. Phil Zarrow gives his advice. ...
Tech Seconds: How to Interpret Ion Chromatography (IC) Results
What should you consider them you analyze ion chromatography results? ...
An Overview of Vacuum Reflow Soldering
Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, and Phil Zarrow, discuss approaches for reaching near zero voiding and how v...
Choosing Flux-Coated Solder Preforms
Kimberly Flanagan, Technical Support Engineer, and Phil Zarrow examine the benefits of flux-coated solder preforms, and how they can improve the manuf...
Benefits of Solder Fortification Preforms
Kimberly Flanagan, Technical Support Engineer, and Phil Zarrow discuss how Solder Fortification® Preforms can help reduce voiding and increase joi...