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One-Step Soldering in Flip-Chip Assembly

Category:
  • Videos
  • Flux
  • BGA
  • This video is for anyone interested in the one-step soldering process challenges in flip-chip/BGA balling.

    Keywords: Phil Zarrow, Andy Mackie, amackie@indium.com, soldering, flip-chip, balling, one-step, two-step, flux, fluxing, solderability, pre-fluxing, BGA, Indium Corporation