Die-attach is the term reserved for processes where the face of a die is attached to a substrate by a single joint. The joint may be of polymer (adhesive), metal-filled polymer, or in the form of solder derived from a preform, solder paste, or solder wire.
Top Solders Technical Documents
Die-Attach Technical Documents
No presentations to display
Safety Data Sheets
No safety data sheets to display
Die-Attach Blog Posts
As discussed in video one of this four video series, there are three attach levels of peak concern in the IGBT stack up. By redefining how we use solder at the die-attach, DBC Substrate, and Baseplate level, we can achieve a more reliable IGBT that can form at increasingly higher standards. If you missed that video, be sure to check it out at www.indium.com/IGBT.
Gold tin eutectic solder (AuSn20, or 80%gold, 20%tin by weight) is used in a variety of applications requiring a high reliability, high melting s...
Soldering IGBTs: Focus on the direct-bond copper substrate level of the stack-up.
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.