Die-attach is the term reserved for processes where the face of a die is attached to a substrate by a single joint. The joint may be of polymer (adhesive), metal-filled polymer, or in the form of solder derived from a preform, solder paste, or solder wire.
Top Solders Technical Documents
Achieving Low-Porosity Sintering of Nano-Ag Paste via a Pressureless Process (Paper)
Die-Attach Technical Documents
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Safety Data Sheets
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Die-Attach Blog Posts
On April 14th, iNEMI will host two webinars for the purpose of discussing a new project geared toward High Temperature, Pb-free Die Attach Materials.
Specific and consistent terminologies are required to enable accurate and effective discussions of soldering materials.
There are at least three significant reasons to use indium solder alloys in your die-attach operation: Physical performance, Supplier reliability, Material dependability: Physical: Indium-containing solder paste is very well proven in low...
Andy C. Mackie, PhD, MSc
Senior Product Manager,
Semiconductor Assembly Materials
From One Engineer to Another®
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