Die-attach is the term reserved for processes where the face of a die is attached to a substrate by a single joint. The joint may be of polymer (adhesive), metal-filled polymer, or in the form of solder derived from a preform, solder paste, or solder wire.
Top Solders Technical Documents
Achieving Low-Porosity Sintering of Nano-Ag Paste via a Pressureless Process (Paper)
Die-Attach Technical Documents
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Safety Data Sheets
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Die-Attach Blog Posts
There exists a wide range of assembly products for the SiP process, especially solder pastes.
On April 14th, iNEMI will host two webinars for the purpose of discussing a new project geared toward High Temperature, Pb-free Die Attach Materials.
Specific and consistent terminologies are required to enable accurate and effective discussions of soldering materials.
Andy C. Mackie, PhD, MSc
Senior Product Manager,
Semiconductor Assembly Materials
From One Engineer to Another®
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