Die-attach is the term reserved for processes where the face of a die is attached to a substrate by a single joint. The joint may be of polymer (adhesive), metal-filled polymer, or in the form of solder derived from a preform, solder paste, or solder wire.
Top Solders Technical Documents
Achieving Low-Porosity Sintering of Nano-Ag Paste via a Pressureless Process (Paper)
Die-Attach Technical Documents
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Safety Data Sheets
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Die-Attach Blog Posts
Soldering IGBTs: Focus on the direct-bond copper substrate level of the stack-up.
There exists a wide range of assembly products for the SiP process, especially solder pastes.
Andy C. Mackie, PhD, MSc
Senior Product Manager,
Semiconductor Assembly Materials
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