Indium Corporation's Die-Attach Wire (or SSDA [soft solder die-attach] wire) is a fluxless solder wire used to effect die-attach. SSDA grade wire will result in higher yields of an improved quality product with fewer interruptions in production.
Key Performance Needs
- Ultralow oxide (wire surface and in wire)
- High alloy purity
- Precise and consistent wire diameter
- Tight alloy chemistry control
Die-Attach Wire Technical Documents
No presentations to display
Safety Data Sheets
Die-Attach Blog Posts
As discussed in video one of this four video series, there are three attach levels of peak concern in the IGBT stack up. By redefining how we use solder at the die-attach, DBC Substrate, and Baseplate level, we can achieve a more reliable IGBT that can form at increasingly higher standards. If you missed that video, be sure to check it out at www.indium.com/IGBT.
Gold tin eutectic solder (AuSn20, or 80%gold, 20%tin by weight) is used in a variety of applications requiring a high reliability, high melting s...
Soldering IGBTs: Focus on the direct-bond copper substrate level of the stack-up.
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.