Choosing Powder Size Part 2: Printing
Solder paste for printing follows the same guidelines as solder paste for dispensing. The good news about solder paste for printing is the apertu...
Solder paste for printing follows the same guidelines as solder paste for dispensing. The good news about solder paste for printing is the apertu...
Folks, We are all aware that the miniaturization of electronics continues unabated. As consumers we benefit from this phenomenon, as electronic assemb...
Ok, so it happened again. Another urgent request was brought to me for action. This time it was a customer who had performed a Red Dye Penetration......
Package-on-Package (PoP) use in the SMT process is slowly creeping from a niche application into mainstream use. From experience, I know that s...
Head-in-pillow defects related to solder paste or flux performance are classified as Materials Issues. These include poor transfer efficiency on stand...
Head-in-pillow defects caused by on-line processing issues are categorized under Process Issues. These include printing, placement and reflow. Printin...
If you are new to Package-on-Package solder paste, expect the material to be lower viscosity then you are used to for printing or even dispensing appl...
In a perfect world, materials printed through a circular stencil aperture would be column-like with a flat top. When you look closely at a printed fl...
For the second half of Solder Paste Transfer Efficiency, I would like to talk about tolerances and the Rule of 10% Standard Deviation (σ). From ...
A great Indium Knowledge Base question came from a customer last week for “recommendations on solder paste height versus component pitch…&...
I just returned from a business trip and encountered a common problem, solder paste squeegee hang up. But like nearly all of the cases I’ve seen...
Folks, In my recent SMT column, “It Pays to be Data Driven,” I asked if anyone new the source of the well accepted industry adage that 2/3...