If you are new to Package-on-Package solder paste, expect the material to be lower viscosity then you are used to for printing or even dispensing applications. The PoP dipping process demands maximum solder transfer, which is provided by a different rheology than stencil printing paste. Pictured here is a new Package-on-Package solder paste. You can actually pour it out of the jar into a flux reservoir!
Package-on-Package Solder Paste Viscosity
Indium Corporation Blogging Team
Indium Corporation Blogging Team
Our blogging team includes engineers, researchers, product specialists, and industry leaders. We share expertise in solder materials, electronics assembly, thermal management, and advanced manufacturing. Our blog offers insights, technical knowledge, and solutions to inspire professionals, showcasing product innovations, trends, and best practices to help readers excel in a competitive industry.
