Indium Blog

Package-on-Package Solder Paste Viscosity

If you are new to Package-on-Package solder paste, expect the material to be lower viscosity then you are used to for printing or even dispensing applications. The PoP dipping process demands maximum solder transfer, which is provided by a different rheology than stencil printing paste. Pictured here is a new Package-on-Package solder paste. You can actually pour it out of the jar into a flux reservoir!