Pin-in-Paste Aperture Calculations Using Solder Preforms with StencilCoach
Folks, As mentioned in the last post, it is a common problem with the PIP (pin-in-paste) process to struggle to get adequate solder volume. If ...
Folks, As mentioned in the last post, it is a common problem with the PIP (pin-in-paste) process to struggle to get adequate solder volume. If ...
Part 5: Solder Mask Defined vs. Copper Defined (Non-Solder Mask Defined) Pads Figure 1. In the last discussion we statistically evaluated an...
The plane landed, I got my bags, and I drove home. What a great show. The SMTA International show took place September 28 to October 2 this year in Ro...
Folks, The pin-in-paste (PIP) process is often the best choice when the PCBA is a mixed SMT and through-hole board with a small number of thr...
Folks, A while ago, I developed an Excel-based spreadsheet, StencilCoach™, that calculates optimal stencil aperture parameters for several commo...
In our continued investigation and quest to improve solder paste printing for fine-feature paste deposits, we also found that consistency (low standar...
SMT Optimization for Success Part 3: Flux Chemistry In our continued discussion on optimizing the stencil printing process (see Part 1, Part 2), the t...
(See Part 1) When discussing success in solder paste stencil printing for SMT assembly, one of the most important tools in an engineer‘s “...
Let’s talk viscosity. Most of us are experienced with paint. Paint is a thick liquid that is applied to a surface and then, for the most p...
SMT Optimization for Success in Printing Ultrafine Solder Paste Deposits The SMT industry widely accepts that ~60% of solder defects occur at the ste...
Folks, It is hard to imagine, but it has been just a little short of 13 years ago that Jim Hall, Phil Zarrow and I approached SMTA’s JoAnn Strom...
Over the last few years, miniaturization, and the drive for increased yields and lower defect rates, have forced the electronics manufacturing industr...