Has the Time Come for Tin-Bismuth Solders?
Folks, When the industry was preparing to transition to lead-free solders almost ten years ago (can it have been that......
Folks, When the industry was preparing to transition to lead-free solders almost ten years ago (can it have been that......
Folks, Patty had been working with engineering on a new product that needed a very precise and controlled volume of the stencil printed “brick&...
Tombstoning, simply, is the wetting of one side of a component before the other side, which causes the setting forces of the solder to lift the compon...
Folks, Let’s assume you are trying to improve the productivity of your SMT assembly lines. You work at a facility that manufactures high v...
Folks, The conclusion of the Bob and Fred break saga…... Phil stared, “The uptime on AXI’s four SMT production lines is…...
(continued from previous post) “Fred break, Bob break?” Phil asked. Folks, The “Fred and Bob Breaks“ saga continues, &ldq...
I just visited a customer that was converting from water soluble solder paste to no-clean. Not exactly a slam dunk transition as this customer found o...
Recently I was at a customer who reported that their SMT components were “blowing off” their PCB. In most of the instances the component w...
Did you ever hear the expression, “think like a 12-year-old”? Meaning a 12-year-old has enough learning to address a problem but not...
… and we’re back on the question of “how small a solder powder particle do I need, to achieve a certain bump height or bump diameter...
This week’s topic is both wafer bumping and substrate bumping with solder paste, and the issue of powder size. I’ve recently been dea...
Folks, Answers to the quiz of a few weeks back…... Phil and Rob had agreed to ask the GM if it was OK to ask the tech and engineers at some of...