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SMTAI 2017: Warpage-Induced Defects Panel & Show Overview

Category:
  • Head In Pillow
  • Solder Defects
  • Videos

  • Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, and Phil Zarrow preview some of the events they are looking forward to at SMTAI 2017, including a panel Brook is chairing on Warpage-Induced Defects & Component Warpage Limits and a workshop Phil and his colleague Jim Hall are presenting on Defect Reduction in Process Failure Analysis.