Posted On: December 31st, 2018 | By: Dr. Ron Lasky

Use FMEA to Manage Tin Whisker Risk

Failure modes and effects analysis is a good strategy to assess tin whisker risk, and the risk priority number plays a crucial role in this analysis, ...

Posted On: September 6th, 2017 | By: Indium Corporation®

SMTA International 2017: Warpage-Induced Defects & Component Warpage Limits Panel Discussion

Brook Sandy-Smith will chair a panel on Warpage-Induced Defects & Component Warpage Limits at SMTAI 2017 ...

Posted On: September 6th, 2017 | By: Phil Zarrow & Indium Corporation®

SMTAI 2017: Warpage-Induced Defects Panel & Show Overview

Brook Sandy-Smith and Phil Zarrow preview some of the events they are looking forward to at SMTAI 2017 ...

Posted On: July 1st, 2016 | By: Phil Zarrow

Introduction to Head-in-Pillow and Non-Wet Open Defects In Electronics Assembly

This video is for anyone interested in mitigating head-in-pillow and non-wet open defects. Keywords: Phil Zarrow, Glen Thomas, askus@indium.com, head-...

Posted On: April 8th, 2016 | By: Phil Zarrow & Dr. Ron Lasky

Assessing Field Reliability and Defect Rates in Electronics Assembly

This is video is for electronics assemblers who are required to assess field reliability. It includes determining whether or not statistical sampling ...

Posted On: April 4th, 2016 | By: Eric Bastow

Pros and Cons of Convection Reflow Soldering using Nitrogen

Electronics manufacturers who have considered implementing nitrogen in their soldering process know the largest obstacle is cost. Let's explore....

Posted On: February 4th, 2016 | By: Eric Bastow

In Soldering, Understanding the Cause and Cure for NWO (Non-Wet Opens)

Non-Wet Opens (NWO): Understand the cause as well as the necessary flux technology to mitigate them....

Posted On: June 1st, 2015 | By: Dr. Ron Lasky

Lead Free 2015

Folks, It is hard to believe that in July we will celebrate the 9th anniversary of the advent of RoHS. So the timing seemed right when I was recently ...