How Different TIM Materials Affect Thermal Resistance Over Time
Some thermal interface materials (TIMs) perform better with time....
Heat-Spring®
How the Performance of Compressible Thermal Interface Materials Changes With Pressure
Metal thermal interface performance is effected by pressure...
Thermal Management Using Indium Metal: The Heat-Spring®
High performance thermal management requires high performance materials. In this case, Heat-Spring®...
IMAPS 2014: See Indium Corporation at the International Symposium on Microelectronics
The 47th International Symposium on Microelectronics will be held in San Diego, CA, on October13th through the 16th, 2014. Here’s the IMAPS 2014...
Indium Preforms
Indium preforms offer very precise volumes of solder, and are cut to fit some very interesting bond-line shapes. Some examples of preform applications...
IMAPS 2013: International Symposium on Microelectronics
The 46th International Symposium on Microelectronics will be held in Orlando, Florida, September 30th through October 3rd, 2013. I will be attending b...
What Is Indium?
Being the Indium Corporation, we know what indium is, where it comes from, and how to use it. But sometimes we forget that not everyone is as im...
Metal Thermal Interface Material Eliminates the WRRRRRRR!
A fisherman and tech guy at heart. Ross Berntson VP Sales Marketing and Tech Support Here is a story of a PC, a thermal management problem, an advance...
Options for Attaching Power Amplifiers: Soldering & Thermal Management
Power amplifiers and transistors come in many shapes and sizes. The performance requirements vary as well. Attaching them can be a critical aspect of ...
Heat-Spring® Thermal Interface Video Release
Sampling, receiving, and testing indium Heat-Spring® compressible thermal interface materials are easier than ever! Not only are standard sam...