Power amplifiers and transistors come in many shapes and sizes. The performance requirements vary as well. Attaching them can be a critical aspect of your design.
Both Pb and Pb-free alloys can be manufactured as a solder preform with a flux coating.(Learn more) Selecting the right alloy and flux coating can be crucial to meeting your void criteria.
A high-tech SOLDERING solution might include NanoFoil®, which effects a solder joint while minimizing heat exposure to your components.
There are also thermal interface materials such as the HEAT-SPRING® which utilize the unique properties of indium to create a superior thermal connection, similar to a solder joint.
There are many different attachment methods available, contact me with your design parameters and we can find your solution.