Indium Blog

Indium Preforms

  • Heat-Spring®
  • Indium
  • Indium Corporation
  • Solder
  • Solder Preforms
  • Solderability

  • Indium preforms offer very precise volumes of solder, and are cut to fit some very interesting bond-line shapes.

    Some examples of preform applications are: bonding lids on sealed packages, thermal interfaces, and custom cut cryogenic sealing gaskets. We even know how to make a boring old rectangular preforms "exciting" (and highly more functional) - by patterning the surface. (Click here to learn about HeatSpring® technology).

    Want to learn about other indium forms? Click Here

    Authored by previous Indium Application Manager Jim Hisert