Indium10.1 Solder Paste
Leading Print Performance on Miniaturized Components
Indium Corporation’s Indium10.1 Solder Paste is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes.
The oxidation-inhibiting properties of Indium10.1 solder pastes promote industry-leading head-in-pillow and graping resistance, with complete coalescence, even after long reflow profiles. The exceptional soldering ability of Indium10.1 solder paste makes it the best solution for components with less-than-ideal solderability and challenging RF shield metallizations.
Indium10.1 solder paste enables the lowest cost of ownership to PCB assembly manufacturers through an all-around balanced performance in both high print and soldering yields. It boasts a versatile, well-balanced set of properties with best-in-class printing and soldering performance. Indium10.1 solder paste provides industry-leading print definition and transfer efficiency, low voiding performance, and head-in-pillow and graping resistance.
Indium10.1 Solder Paste is part of Indium Corporation’s family of high performance, lead-free solder pastes. The series was designed to provide multi-faceted performance characteristics, bringing the right balance of solder paste attributes tailored specifically to each specific manufacturing process. Each paste in the series was developed to optimize print performance and mitigate common defects faced by manufacturers of personal electronics, such as QFN voiding, head-in-pillow, and graping.
Indium10.1 Technical Documents
No whitepapers to display
No presentations to display
Safety Data Sheets
Solder Paste Blog Posts
What is the ideal time-above liquidus during solder reflow? Too long or too short can cause dewetting and charring, or not allow the intermetallic formation to wet.
The second stage of a reflow profile activates the flux in the solder paste and prepares the solder for reflow. This can be a critical stage to avoid defects such as tombstoning, voiding, graping, and non-wetting.
It is important to understand the different stages of a reflow profile and how they can affect the end solder joint.
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.