Avoid the Void® Challenge

Have you had field failures due to mechanical or thermal reliability issues caused by voiding? Do you have voiding specifications that seem impossible to meet?

Indium Corporation can help you Avoid the Void® with our unique solder paste chemistries, including Indium10.1 Solder Paste and Indium8.9HF Solder Paste. These chemistries are specifically formulated for ultra-low voiding under bottom termination components, such as QFNs, DPAKs, MOSFETs, BGAs, and LGAs.

other pastes >62% voiding
Indium8.9HF <15% voiding
Indium10.1 <10% voiding

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