Avoid shortened product life; avoid field failures; avoid customer dissatisfaction, plus a whole lot more with Indium Corporation’s advanced solder paste technology.
Indium Corporation’s suite of solder pastes offers formulations designed to deliver low-voiding, plus enhanced benefits such as improved response-to-pause, stability, HiP minimization, reliable in-circuit testing, and enhanced SIR performance.
Indium8.9HF-1 Solder Paste provides industry-leading ICT probing first-pass yields due to the ease of probe penetration through the soft residue.
The following data represents an evaluation of Indium8.9HF-1 vs. four competitive materials in a production environment. Indium8.9HF-1 produced the best ICT First Pass Yield and exceptional printing First Pass Yield.