Avoid shortened product life; avoid field failures; avoid customer dissatisfaction, plus a whole lot more with Indium Corporation’s advanced solder paste technology.
Indium Corporation’s suite of solder pastes offers formulations designed to deliver low-voiding, plus enhanced benefits such as improved response-to-pause, stability, HiP minimization, reliable in-circuit testing, and enhanced SIR performance.
Indium8.9HF Solder Paste
Indium8.9HF Solder Paste provides consistent performance after room temperature or cold storage, and throughout the assembly process.
Storage Conditions (unopened containers)
30 days max
Room Temperature Stable
Indium10.1HF Solder Paste
Indium10.1HF Solder Paste minimizes solder beading and offers outstanding performace compared to the competitive material.
The solder beading test is designed to be a worst-case scenario and uses pad designs that aggravate solder beading.
Solder Beading Test
Indium8.9HF-1 Solder Paste
Indium8.9HF-1 Solder Paste provides industry-leading ICT probing first-pass yields due to the ease of probe penetration through the soft residue.
The following data represents an evaluation of Indium8.9HF-1 vs. four competitive materials in a production environment. Indium8.9HF-1 produced the best ICT First Pass Yield and exceptional printing First Pass Yield.
Indium10.1 Solder Paste
Indium10.1 Solder Paste virtually eliminates the head-in-pillow defect (HiP) with industry-leading oxidation barrier flux technology.