Indium Blog

A Simple NanoFoil® Demonstration

Category:
  • Indium Corporation
  • NanoFoil®
  • Solder
  • Solderability
  • Soldering

  • Here is a straightforward demonstration of NanoFoil® activation.

    NanoFoil is a heat source that is used to bond / solder electronics components (to name one of many applications). Assembly requires (compressive) pressure.

    In this demonstration NanoFoil is used to bond tin-coated copper blocks (with finger pressure). It is ignited with a standard 9 volt battery.
    Although it reaches about 1,500 degrees Celsius, the soldering area is only a few microns thick, so it cools to the touch within seconds, and the bondline is very strong.

    Authored by previous Indium Application Manager Jim Hisert