NanoFoil is a heat source that is used to bond / solder electronics components (to name one of many applications). Assembly requires (compressive) pressure.
In this demonstration NanoFoil is used to bond tin-coated copper blocks (with finger pressure). It is ignited with a standard 9 volt battery.
Although it reaches about 1,500 degrees Celsius, the soldering area is only a few microns thick, so it cools to the touch within seconds, and the bondline is very strong.