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An Interview with Michael Qiu 采访邱学丞

Michael Qiu supports Indium Corporation in Eastern China.  I thought an interview with him would be a good chance to see the semiconductor industry from a different perspective.

 

 

邱学丞服务于铟泰中国华东区。采访他会是个从另一个角度去认识半导体行业的绝好机会。

 

 

 

 

 

Jim: How long have you been involved in the semiconductor industry in China?

 

 

吉姆:你在中国从事半导体行业多久了?

 

 

 

Michael: I have been in the semiconductor industry in China more than three years. Before that, I spent four years learning IC design, IC manufacture and Package in a University in Shanghai.

 

 

邱学丞:有三年多了。在这之前我花了四年时间在上海某大学学习IC设计、制造 (Fab)和封装。

 

 

 

 

 

Jim: What semiconductor materials are most popular for your customers?

 

 

吉姆:在你的客户中哪些半导体材料用的比较多?

 

 

 

Michael: For some semiconductor package customer, silver epoxy is very popular applied to do die attach. As for high power device, paste/SSDA is used popular for die attach. But for some advanced customers who do BGA, FC and WLCSP business, flux or fine power paste is required.

 

 

邱学丞:在一些封装厂里,银浆被大量地用来贴芯片于框架上。对那些做大功率器件的客户来说,锡膏或者焊线用来贴芯片比较普遍。而那些做BGA, FCWLCSP的客户,他们需要的则是助焊剂或者精细颗粒锡膏。

 

 

 

 

 

Jim: What trends do you see in semiconductor package manufacturing in China?

 

 

吉姆:你觉得中国半导体封装的趋势如何?

 

 

 

Michael: For [cost sensitive] customers who do Diodes/Transistor package, the manufacture cost will be more and more important.

 

 

BGA/FC/CSP package share will increase soon in the near future and more factories will be able to do those packages.

 

 

More advanced package like SIP (system in a package) and MCM (multi-chip module) will [become] popular, but this may take several years.

 

 

邱学丞:对那些制造二极管或三极管的客户来说,成本对竞争力非常重要。他们对材料的成本以后会愈加敏感。在封装市场中,BGA/FC/CSP市场份额会有迅速的增长,而且会有更多的厂家能做这些封装。还有一些更高端的封装技术,比如SIP (system in a package) MCM (multi-chip module) 会开始流行,当然这得花个好几年时间。

 

 

 

 

 

Jim: What topics would our customers in China like to see in the Semiconductor Packaging Blog?

 

 

吉姆:中国的客户希望在半导体封装博克上看到什么样的话题?

 

 

 

Michael: Our customers always hope to get our professional technical support. They prefer the blog on a particular application or issue. For example, comparison between In and AuSn in LD die attach and use dilute hydrochloric acid to remove oxidation layer on In preforms.

 

 

邱学丞:我们的客户总是会希望能得到更好的专业支持。他们会比较喜欢主题明确,针某个具体应用或者问题的一些文章。比如:“LD芯片贴装应用中InAuSn的对比”和“用弱盐酸去除铟焊片表面的氧化物”。

 

 

 

 

 

Jim: What is the most exciting thing about the semiconductor industry to you?

 

 

吉姆:半导体行业中什么东西最让你觉得激动?

 

 

 

Michael: A chip which is smaller than your nail has so many functions.

 

 

邱学丞:一个比你指甲还小的芯片能拥有如此多的功能,这太迷人了。