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Causes and Solutions to Voiding in Die-Attach

This video is for engineers challenged by voiding in die-attach electronics assembly applications. It covers causes and methods to Avoid the Void®.


Keywords: indium, Indium Corporation, void, voiding, voids, Avoid the Void®, die-attach, soldering, SEM, reflow, Andy Mackie, voiding performance, solderability, reflow solder, die-attachment