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Coefficient of Thermal Expansion

When dealing with bonding, we often mention CTE (Coefficient of Thermal Expansion). This is a very important topic when designing a soldered interface, whether you are choosing materials that will expand and contract at the same rate or bonding alloys or processes that will handle the stress of deformation caused by these changes. This topic has been explored by hundreds of people, but I like this video because the presenter is both thorough and fun: