His article highlighted a point contrary to the theory I am familiar with, which is the negative thermal reliability issues associated with a shrinking die size. Although a shrinking die size does typically lead to a hotter chip which is difficult to cool, from a solder TIM perspective, a larger die is more heavily stressed by slow operating temperature cycles.
For this reason, Bredmann cites a trend that the larger the die size and solder TIM is, the fewer numbers of temperature cycles it takes for failure. It is written that the number of cycles to failure is inversely proportional to the size (radius) of the solder joint squared. ӂ