Indium Blog

Practical Suggestions for Solder Preform Design and Implementation

Have you ever found yourself knowing where you want to go, but not sure how to get there?

This can be frustrating and time consuming if not impossible without a map. It can be the same when introducing a solder preform into your process. You know what you hope to achieve by adding a preform, but where do you start to design it?  Whether you’re thinking of designing a solder preform into your build, or using one to replace solder paste, the approach is generally the same.

·         The solder volume should be sufficient to meet the desired reliability and performance criteria.

·         The geometric constraint is normally derived by the component being soldered and the desired bond line thickness

·         The soldering temperature of the alloy should not be high enough to damage components, but robust enough to withstand the device's max operating temperature.

·          If step soldering, then the melting temperature of the alloy needs to fall into the reflow hierarchy you have designed for your process.

·         Surface metallization should be compatible with the solder used to make the joint.

Although this is a simplified list, it does offer a starting point.  For more information follow this link,  Practical suggestions for solder preform design

If this doesn’t get you there, feel free to contact me directly 315-853-4900 ext. 2106