Posted On: November 15th, 2011 | Tags:Category:
Following on from our discussions of last time...
As you will recall from the previous post on this topic, My friend and colleague Chris Nash and I were discussing some puzzling results for low dip height found during testing of package-on-package (PoP) materials. The findings will be of interest to everyone who uses a dipping process in both SMT and flip-chip assembly.
As always, please contact me if you need to learn any more.