A NanoBond® acts like a traditional solder bond in many ways. After reaction, the bulk properties of NanoFoil® are similar to that of many solders. To me, the property that is most attractive (since it is similar to that of a solder) is the thermal conductivity of reacted NanoFoil®.
Just like tradition solder bonds, NanoBonds far surpass the thermal conductivity of conductive epoxy (by around 6x-10x), making it an exceptional material for thermal interface applications.
If you’d like to try NanoFoil® for a thermal application, kits are available here.