Microsphere quality is especially important for bumping wafers. The dimensional tolerance of microspheres impacts the bump co-planarity across a wafer surface. In short, more precise spheres directly influence the quality of bumps on the die. This will of course increase process yield since the spheres will all be closer to the pads they are being soldered to.
Wafer-Level Microsphere Bumping (Microspheres)
Indium Corporation Blogging Team
Indium Corporation Blogging Team
Our blogging team includes engineers, researchers, product specialists, and industry leaders. We share expertise in solder materials, electronics assembly, thermal management, and advanced manufacturing. Our blog offers insights, technical knowledge, and solutions to inspire professionals, showcasing product innovations, trends, and best practices to help readers excel in a competitive industry.
