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Semiconductor Packaging Materials – Find What You’re Looking For

Indium Corporation Blogging Team

  • Are you looking for information on semiconductor packaging materials? Send your request to [email protected]. It’s all fair game – released, experimental, or competitor materials. Flux characteristics, paste properties, application methods…

    Inquire about any of the following topics:

    • Pin transfer
    • Package-on-Package (PoP)
    • Solder spheres
    • Glass transition temperatures (Tg)
    • Flip chip assembly
    • BGA rework
    • Cross-sectioning electronic components
    • Paste for component dipping
    • Solder alloys
    • Liquid fluxes
    • Wafer bumping
    • Low alpha solder
    • Spin coating
    • Redistribution layers (rdl)
    • Halogen-free
    • Flux viscosity
    • Solder paste viscosity
    • Whatever else you are interested in

Indium Corporation Blogging Team

Our blogging team includes engineers, researchers, product specialists, and industry leaders. We share expertise in solder materials, electronics assembly, thermal management, and advanced manufacturing. Our blog offers insights, technical knowledge, and solutions to inspire professionals, showcasing product innovations, trends, and best practices to help readers excel in a competitive industry.

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