OBSESSED With Solder Paste

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Solder Pastes

Indium Corporation offers a wide selection of solder pastes to choose from, in order to meet each customer's specific needs. Besides having a selection of over 220 alloys, Indium Corporation offers several flux types that encompass a variety of more fine-tuned formulations. Please select from the table below to see detailed information on solder pastes that most interest you.

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PB-FREE SOLDER PASTE
No-Clean
Indium5.1 AT Pb-Free Solder Paste With an industry leading "response-to-pause" printing performance and very low voiding in BGA assemblies, this No-Clean, Pb-Free solder paste performs well in both high-volume and high-mix surface mount assembly processes.
INDIUM5.8 LS Pb-Free Solder Paste This No-Clean, Pb-Free solder paste is completely halide-free and was specifically formulated to reduce solder beading under passive components and flux spattering onto gold finger contacts.
Indium8.9 Pb-Free Solder Paste Indium8.9 Pb-Free Solder Paste is an air reflow no-clean solder paste that prints perfectly every time. Indium8.9 was formulated to produce consistent print volumes through apertures below the industry recommended minimum area ratio of 0.66. From cell phones to Mother Boards - Indium8.9 does it all.
NC-SMQ230 Pb-Free Solder Paste This industry proven No-Clean, Pb-Free solder paste reflows extremely well at low peak temperatures (229 C) to allow minimal thermal impact on boards and components.
NC-SMQ81 Solder Paste Designed for use with low temperature Bismuth containing alloys [Indalloy #281 (58Bi/42Sn) & #282 (57Bi/42Sn/1Ag)]. A peak temperature of at least 170° C is recommended for no-clean applications.
NC-SMQ80 Solder Paste For use with Indium containing alloys with a peak reflow temperature of <280° C. Pb-Free alloys include Indalloy #1E, #290 and #4.
NC-SMQ51SC Solder Paste A robust solder paste compatible with a wide array of alloys covering the entire soft solder temperature range. Application methods include stencil printing and dispensing.   It can be used for the high temperature Pb-Free alloy 80Au/20Sn having a melting point of 280° C.
Water Washable
Indium3.1 Solder Paste This Pb-Free, Water-Wash solder paste exhibits exceptional printing, a long stencil life, wide reflow profile window while maintaining excellent cleanability even at elevated reflow temperatures.
Indium3.2 Pb-Free Water-Soluble Solder Paste This Pb-Free, Water-Wash solder paste exhibits consistent fine-pitch printing performance with high transfer efficiency from stencil apertures, superior fine-pitch soldering ability, wide reflow profile window, excellent response-to-pause printing performance, outstanding slump resistance, low voiding, minimal foaming during the cleaning process, and excellent wetting.
RMA SOLDER PASTE
RMA-SMQ51AC Solder Paste A robust solder paste compatible with a wide array of alloys covering the entire soft solder temperature range. Application methods include stencil printing and dispensing.
RMA-SMQ51A Solder Paste A derivation of RMA-SMQ51AC designed to have high tackiness and ultra-low voiding.
WATER WASH SOLDER PASTE
Indium3.1 Solder Paste This Pb-Free, Water-Wash solder paste exhibits exceptional printing, a long stencil life, wide reflow profile window while maintaining excellent cleanability even at elevated reflow temperatures.
Indium6.2 Water-Soluble Solder Paste Newer generation material designed to maximize production yields by minimizing printing & reflow related defects. Indium6.2 can be used with Sn63 & Sn62 eutectic alloys.
Indium6.8 Solder Paste This solder paste features a wide reflow profile, exceptional printing, an unprecedented stencil life, and wide humidity tolerance.
WMA-SMQ65 Solder Paste Can be used with Sn63 & eutectic alloys. Also the material of choice for Indium containing alloys having a melting point >180° C.
WMA-SMQ69HT High Temperature Water Soluble Solder Paste A high temperature water washable flux for use with high Pb bearing alloys requiring a peak reflow temperature up to 350° C. Not for use with eutectic Sn/Pb based alloys or 80Au/20Sn.
NO-CLEAN SOLDER PASTE
Indium5.1 AT Pb-Free Solder Paste Because of an industry leading "response-to-pause" printing performance and very low voiding in BGA assemblies, this No-Clean, Pb-Free solder paste performs well in both high-volume and high-mix surface mount assembly processes.
INDIUM5.8 LS Pb-Free Solder Paste This No-Clean, Pb-Free solder paste is completely halide-free and was specifically formulated to reduce solder beading under passive components and flux spattering onto gold finger contacts.
Indium8.9 Pb-Free Solder Paste Indium8.9 Pb-Free Solder Paste is an air reflow no-clean solder paste that prints perfectly every time. Indium8.9 was formulated to produce consistent print volumes through apertures below the industry recommended minimum area ratio of 0.66. From cell phones to Mother Boards - Indium8.9 does it all.
NC-SMQ92J Solder Paste Industry standard, features include a probe testable residue, consistent print volumes, long stencil life and excellent wetting to all common board finishes. All 92 series solder pastes are halide-free with a ROL0 flux type classification per IPC J-STD-004A.
NC-SMQ92H Solder Paste A harder residue version of NC-SMQ92J offering all the same features and unsurpassed performance.
NC-SMQ51SC Solder Paste A robust solder paste compatible with a wide array of alloys covering the entire soft solder temperature range. Application methods include stencil printing and dispensing.
NC-SMQ80 For use with Indium containing alloys with a peak reflow temperature of <280° C. Common alloys include Indalloy #1E, #290, #204, #205 and #7.
NC-SMQ81 Solder Paste Designed for use with low temperature Bismuth containing alloys [Indalloy #281 (58Bi/42Sn) & #282 (57Bi/42Sn/1Ag)]. A peak temperature of at least 170° C is recommended for No-clean applications.
Indium 9.72 Die Attach Solder Paste Designed for dispensing high temperature die attach alloys used in the Power Semi-Conductor Industry including 85Pb/10Sb/5Sn & (92.5Pb/5Sn/2.5Ag).