circuit board

Phil Zarrow

Phil Zarrow

President and Principal Consultant ITM Consulting,
Spring Hill, TN USA

Indium Corporation
E-mail: itm@itmconsulting.org

Blog

Phil Zarrow's Blog

Biography

Phil Zarrow has been involved with PCB fabrication and assembly for more than thirty-five years. His expertise includes the manufacture of equipment for circuit board fabrication and assembly of through-hole and surface mount technologies. In addition to his background in automated assembly and cleaning, Mr. Zarrow is recognized for his expertise in surface mount reflow soldering technology and in the design and implementation of SMT placement equipment and reflow soldering systems. Having held key technical and management positions with Vitronics Corporation, Excellon-Micronetics and Universal Instruments Corporation, he has extensive hands-on experience with set-up and troubleshooting through-hole and SMT processes throughout the world. During his tenure as Director of Technology Development for GSS/Array Technology, he was responsible for specifying and setting up medium- and high-speed assembly lines, as well as investigating and implementing emerging and leading-edge technologies, equipment and processes.

Since forming ITM in 1993, Phil Zarrow has helped numerous clients in such areas as

  • SMT Implementation and Assembly facility set-up
  • SMT Assembly and Soldering Process Failure Analysis
  • EMS/Supplier Process and Quality Assessment Audits
  • Counterfeit Component Avoidance and Interception Programs
  • Manufacturing yield improvement
  • Equipment Evaluation and Selection
  • No-clean and lead-free solder paste evaluation and process implementation
  • SMT Manufacturing Process Audits and process improvement
  • On-site training for all levels of personnel
  • Design for Manufacturability (DFM) specification development
  • Reflow of Through-hole feasibility, development and implementation
  • Implementation of new component packages including QFN, BGA, CSP and Flip-Chip
  • SMT process equipment benchmark testing and evaluation
  • SMT product development
  • Lead-free Process Implementation and Optimization
  • Technical evaluations related to business acquisitions and mergers
  • Technical assistance in legal disputes

Mr. Zarrow is a popular speaker and workshop instructor. He has chaired and instructed at numerous seminars and conferences in North America, Europe, and the Pacific Rim. He has published many technical papers and magazine articles as well as contributed a number of chapters to industry books. He is co-author of the book, "SMT Glossary- Terms and Definitions". Mr. Zarrow holds two US Patents concerning PCB fabrication and assembly processes and audit methodologies.

Phil is a member of IPC, SME, IMAPS, a co-founder of ITM Incorporated, and is a past national level officer and national director of the Surface Mount Technology Association (SMTA). He was also Chairman of the Reflow Committee for SMEMA. He was the recipient of the SMTA's Member of Distinction Award (1995) and Founders’ Award (2000). Mr. Zarrow has served on the Editorial Advisory Board for Circuits Assembly Magazine and won awards for his writings "On the Forefront" and “Better Manufacturing” columns. He is currently producer and co-host of Circuit Insight’s “BoardTalk” audio program.

Phil Zarrow's Blog Posts

Wave Flux and Reliability

19 Mar 2018 by Phil Zarrow [view bio]

Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, and Phil Zarrow discuss the use of pallets when wave soldering and its impact on flux creep, which can potentially causing electrochemical migration. They also discuss the methods that can be used to uncover such issues.

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Wave Flux Applications & Pre-Heat Considerations

12 Mar 2018 by Phil Zarrow [view bio]

Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, and Phil Zarrow discuss the pre-requisites of wave flux application, such as ensuring even flux distribution and adequate hole fill, as well as best practices.

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History & Future of Resistivity Of Solvent Extract (ROSE) Testing

05 Mar 2018 by Phil Zarrow [view bio]

Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, and Phil Zarrow discuss the history of the ROSE test method, its gradual descent into obsolescence, and the need for a scientifically-proven testing process.

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