Skip to content

Back to Blog

A Package-on-Package “How To”

Indium Corporation Blogging Team

A new tutorial on assembling package-on-package components is available.Click here for the PoP Guide and other application notes.

Indium Corporation Blogging Team

Our blogging team includes engineers, researchers, product specialists, and industry leaders. We share expertise in solder materials, electronics assembly, thermal management, and advanced manufacturing. Our blog offers insights, technical knowledge, and solutions to inspire professionals, showcasing product innovations, trends, and best practices to help readers excel in a competitive industry.

Related Articles

Blog
Support

New StencilCoach Add In to Calculate Apertures to Minimize Solder Balling

Folks, The creation of solder balls, when assembling passive discrete components, has been an issue for decades (see Figure 1). The discovery that the “home plate” stencil aperture design

View Post
Person interacting with a tablet, displaying floating chat bubbles symbolizing digital communication.
Blog
Products

Unlock Savings with Indium Corporation’s Reclaim and Recycle Program

Navigating today’s competitive business landscape demands innovative strategies for cost management and operational efficiency. Indium Corporation's Reclaim and Recycle Program addresses

View Post
Person interacting with a tablet, displaying floating chat bubbles symbolizing digital communication.
Blog
Products

Demystifying Recycling and Reclaiming: A Guide to Sustainable Practices

Unlock new efficiencies in your manufacturing process with Indium Corporation's Reclaim and Recycle Program—a visionary approach that turns post-manufacturing scrap into valuable resources.

View Post
View All