Because I secretly love cheesy blog titles and because I wish I had a better high school senior portrait:
At our last thin film tradeshow (as of this post), we displayed a molybdenum sputtering target designed for 450mm semiconductor wafer deposition.
What’s so special about this sputtering target? As if materials ready for the next evolution of semiconductor processing aren’t interesting enough – the ~22” diameter piece of Mo was bonded to the aluminum backing plate at room temperature! This method used to join targets and other materials without external heating (and the deformation it creates) is called the NanoBond™ Process.
BTW: That nervous high school look in my eyes is really me thinking: “I hope I don’t drop this on my foot!”