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Indium and Flip Chip Bonding

Category:
  • Solderability
  • Solder Reliability
  • Solder Bumping
  • Soldering
  • Solder
  • Indium Corporation
  • Indium
  • Chip Attach

  • Au stud bumped flip chip attachment?  Low temperature assembly requirements? Indium is your answer…

     

     

     

     

     

    Indium can be used in many ingenious ways to attach flip chips.  It can be used for solder interconnections, cold-weld attachments, and even low temperature solid-state diffusion bonding.  The pliable nature of indium allows it to perform well during reliability testing - such as temperature cycling.