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Minimizing the Head-in-Pillow Defect in SMT Assembly

  • SMT Solder
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  • This video is for those in the SMT electronics assembly industry that want to minimize the head-in-pillow defect. It discusses the solder paste properties that help overcome this challenge.

    Keywords: indium, Indium Corporation, Dr. Ron Lasky,, Phil Zarrow,, ball grid array packages, reflow, solder paste, stencil printed brick, hot slump, pick and place machine, oxidation barrier, SMTA