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Minimizing the Head-in-Pillow Defect in SMT Assembly

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  • Videos
  • SMT Solder
  • Indium
  • This video is for those in the SMT electronics assembly industry that want to minimize the head-in-pillow defect. It discusses the solder paste properties that help overcome this challenge.

    Keywords: indium, Indium Corporation, Dr. Ron Lasky, ronlasky@aol.com, Phil Zarrow, itm@itmconsulting.org, ball grid array packages, reflow, solder paste, stencil printed brick, hot slump, pick and place machine, oxidation barrier, SMTA