Indium Blog

Pressure During the NanoBond® Process

  • Indium Corporation
  • NanoBond®
  • NanoFoil®
  • Solder
  • Solder Joints
  • Soldering
  • Solderability

  • During a NanoBond® reaction, assembly pressure may determine if you create a quality solder joint. There are many details that can influence how much pressure is actually needed:



    In practice, we use anywhere from a few psi (like the clips shown above) ...


    ... up to 400-500psi (with a press, as shown below) – depending on the criteria listed above.








    The main thing to keep in mind is that you want uniform pressure across your interface.

    As illustrated in the pressure paper images below, uniform pressure across a NanoBond® interface is critical for maximum bond strength.

    We will discuss this further in "Aligning the Assembly".

    *This post is part of the NanoBond® Process series

    Authored by previous Indium Application Manager Jim Hisert