The course discusses the physical, mechanical, and soldering properties and applications of a variety of low-temperature solders, with emphasis on lead-free alloys. Low-temperature soldering is preferred for a number of special applications, such as heat-sensitive devices, systems that require step-soldering, parts with significant differences in their coefficients of thermal expansion, components exhibiting severe thermal warpage, or products with highly miniaturized design.
Ning-Cheng’s presentation is being held on Sept 29, the day before the exhibition opens. If you register before August 28 you can receive 10% off of your registration fee.
And while you’re at the event, be sure to visit Indium Corporation in the exhibit hall at booth #430.