For reasons that I will discuss in a post later this year, a common factor that is emerging in the area of copper-pillar microbump 2.5D and 3D joining, is the adoption of thermocompression (TC) bonding for flip-chip flux/microbump soldering. TC bonding is now being predominantly adopted instead of reflow. Some of you may have the same response as I got at iMAPS 2011 from one well-known expert in packaging technology. He looked askance at me when I mentioned TC bonding for flip-chip and retorted: “That’s for bonding wafers, not soldering flip-chips!”. Even good old Wikipedia (at time of writing) seems to have the same problem – basically that the industry usage of the term has moved into the packaging arena.
I spent a little time talking to people in the industry, and on Google, putting together a buyer’s guide for those of you looking at who-is-doing-what in TC bonding. This is just a prototype guide and necessarily incomplete – if I have missed your company out then I apologize, and will add it in: just give me all the details!
|Equipment Type||Company Name||URL||Bonding tools||What else they make|
|Die-bonders||ASM (PT)||http://www.asmpacific.com/asmpt |
|Die bonders, flip-chip bonders||Various others|
|Die-bonders||BESi||http://besi.com/||Die and flip-chip bonders (Datacon)||Meco (plating systems), Fico (molding / trimming), ESEC|
|Die-bonders||FineTech||http://www.finetech.de/||Die bonders, flip-chip bonders (offline)||SMT/BGA rework, Laser bar-bonder, VCSEL, Photodiodes, Chip-on-glass, RFID|
|Die-bonders||Hybond||http://www.hybond.com/||Eutectic die bonders (offline/manual)||Wirebonders / Peg and bar lead diode bonders|
|Die-bonders||Newport||http://www.newport.com/||Die bonders||Optical and alignment instrumentation, spectrometers|
|Die-bonders||Palomar||http://palomartechnologies.com/||Die bonders||Ballbonders, stud bumpers, manual die bonders|
|Die-bonders||Panasonic||http://www.panasonicfa.com/?id=MD-P200||Die bonders||Wirebonders etc etc|
|Die-bonders||SET||http://www.set-sas.fr/en/||Die bonders, flip-chip bonders||Large device bonders and nano-imprint|
|Die-bonders||Shibaura||http://www.shibaura.co.jp/e/products/||Die bonders, flip-chip bonders||FEOL products (etching, stripping, coating, jetting) and BEOL|
|Die-bonders||Toray||http://www.toray-eng.com/sitemap/index.html#semicon||Die bonders, flip-chip bonders||[Semi]Inspection, exposure, encapsulation. COG / COF / FOG bonders|
|Die-bonders||Westbond||http://westbond.com/machines.htm||Die bonders (offline/manual)||Wirebonders|
|Wafer bonders||EV Group||http://www.evgroup.com/en||Wafer bonders||Lithography tools|
|Wafer bonders||Suss Microtech||http://www.suss.com/||Wafer bonders||Mask aligners, nanoimprinters, photomasks, lithography tools|
Thanks to Brian Schmaltz of Namics kk for one extra addition to the list.