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Variables in the Package-on-Package Process

Category:
  • Flux
  • Gold Solder
  • Indium
  • Indium Corporation
  • PoP Flux
  • Solder Flux
  • Solder Paste

  • When designing a Package-on-Package (PoP) assembly process, there are many variables that need to be considered in order to be successful.  While the chemistry of your PoP dipping flux or paste plays a major role in PoP assembly, there is also much to consider in terms of the components, equipment, and reflow parameters being utilized. 

    In order to help illustrate these variables, I have created the following Ishikawa diagram:

    While I’m sure there are some variables that I have missed, these are the main ones to consider. 

    For help deciding which products are right for your PoP process or help troubleshooting your current process, please contact AskUs@indium.com.