在設計封裝上封裝 (PoP) 組裝製程時，為了取得成功，需要考慮許多變數。雖然 PoP 浸漬助熔劑或錫膏的化學成份在 PoP 組裝中扮演重要角色，但在所使用的元件、設備和回流焊參數方面，也有許多需要考慮的因素。
為了幫助說明這些變數，我建立了以下的石川圖：
雖然我肯定還有一些我遺漏的變數，但這些都是要考慮的主要變數。
如需協助決定哪些產品適合您的 PoP 製程，或協助排除您目前製程的故障，請聯絡[email protected]。
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