Last week, Michael Riddle (Cyber Technologies) and I experimented with liquid fluxes for spin coating / wafer bump reformation. We used a Cyberscan Vantage to examine the topography of the flux at different spin rates and times. The interesting findings will be explained in our upcoming article (placement to be determined).
Dynamics of Liquid Wafer Fluxes
Indium Corporation Blogging Team
Indium Corporation Blogging Team
Our blogging team includes engineers, researchers, product specialists, and industry leaders. We share expertise in solder materials, electronics assembly, thermal management, and advanced manufacturing. Our blog offers insights, technical knowledge, and solutions to inspire professionals, showcasing product innovations, trends, and best practices to help readers excel in a competitive industry.
