A new tutorial on assembling package-on-package components is available.Click here for the PoP Guide and other application notes.
Related Articles
Formic Acid Reflow Soldering: The New Technology that is Clean, Reliable, and Power Ready
At Indium Corporation, we understand the challenges related to power electronics assembly; devices are increasing in complexity, while demands on performance and reliability grow stronger. On top of
New StencilCoach Add In to Calculate Apertures to Minimize Solder Balling
Folks, The creation of solder balls, when assembling passive discrete components, has been an issue for decades (see Figure 1). The discovery that the “home plate” stencil aperture design
Au-mazing Solutions: How AuLTRA® Fine Wire Brings Gold Standard Precision to Medical Devices
In the world of medical device manufacturing, where reliability and precision are critical, materials used in the assembly must meet the highest