Low residue flux for flip chip attachment has many advantages (please see Ultra Low Res Flip Chip Flux) over standard no-clean and water soluble fluxes. Flux offers ease of use, although some applications require a solder paste to compensate for substrate warpage. This wish list (low residue, no-clean process, available in paste form, ect) can be satisfied by a low residue solder paste.
Low Residue Flip Chip Solder Paste
Indium Corporation Blogging Team
Indium Corporation Blogging Team
Our blogging team includes engineers, researchers, product specialists, and industry leaders. We share expertise in solder materials, electronics assembly, thermal management, and advanced manufacturing. Our blog offers insights, technical knowledge, and solutions to inspire professionals, showcasing product innovations, trends, and best practices to help readers excel in a competitive industry.
